MUIT Noida Reviews on Placements, Faculty and Facilities

1. After the 6th-semester students are eligible for the internship and after the 8th-semester students are eligible for campus placements. 2. Genpact, TCS, HSBC, and Wipro are some of the top recruiters of the college. 3. The highest package of this university is 12LPA and the average package is 2-3LPA .profiles offered are a data analyst, software engineer, data scientist, software testing, etc. 4. Almost 30-40% of students get placed in this university. 5. My plans after getting the degree are to give the gate exam and pursue my MTech from the Indian institute of technology.

From the start of the second year, the college gives internship opportunities for the students to gain experience so that even if they don't get or don't want placement from the college, you can always be able to get a job outside

Talking about the placements that are good of muit Many company visits muit like : tcs , hcl , ibm , indianoil , codnizant , paytm , byjus etc Mainly 20 companies visit muit every year for recruiting students

Many extra curricular activities are held along with academics and all students participate equally. There is a ground for basketball and football. The college provides boarding for boys. Also the canteens serve delicious snacks. The infrastructure is also quite good with well-equipped labs.

To make it ease it has built well structured information based website where most of the relevant information and updates are always available. Students are taught with new adapted technical ways throughout the session. The labs are good but the practicals are not done seriously.

It's very much important to know the Interest, Strength and Weakness of every individual and that what MUIT provides Life Skill Classes and Career Counseling to all students. MUIT has a very keen interest and observation on education and its changing trend. All academic blocks and labs are well-maintained. The labs are centrally air-conditioned with proper pieces of equipment and study material.