KIIT School of Rural Management Bhubaneswar Reviews on Placements, Faculty and Facilities

The 3 rd semester students are eligible for campus placements andThe average package in the placements is Rs650000 LPA and the highest package is Rs900000 LPA and the companies like Bigbasket, syngenta, veggrow, dehaat, rasi seeds, Bayer and many multi companies are present during the placement drive and all the students gets placed in the companies except for some.

100% Placements and every student gets internship opportunities. Till now, in our 2022-24 batch the highest package is 8.8 LPA, with an impressive average package of 5.5LPA. Companies: FMCG (Adani Wilmar, NDDB, Reliance Retail, ITC, Nestle, Amul, Bisk Farm); Agri Input (Bayer, Adam, UPL, Seed Works, VNR, Pan Seeds, Zydex); Banking and Microfinance (BFIL, HDFC, ICICI Securities, Bandhan, Avanti Finance, Annarpurna); Agritech and supply chain (Big Basket, Dehaat, Vegrow, Mahindra) etc. The emphasis is evident from the very first semester, where the students receive guidance for GD and Mock PI sessions. But formally the placement training starts from second year by KIIT Kareer School having aptitude and psychometric tests and expert guidance on resume and interview etc.

In terms of placements, students undergo extensive training to hone ktheir skills in Group Disscusions (GD), Personal Interview (PI) and aptitude tests, ensuring their readiness for the recruitment process. The average placement package for graduates is commendable, standing at 5.5 Lakhs per annum (LPA), while the highest recorded package reaches an impressive 9.5 LPA. The placements is charaterized by various renowned companies accoss various sectors. For agri input - UPL, Bayer, U.S Agri , VNR, Crystal, PAN, Nuziveedu etc. Banking intitues such as - ICICI , HDFC, Avanti finance, Bandhan Bank,etc. Fmcg companies - Adani, Emami , Bisk Farm , Nestle, Amul etc. Supply chain and Procurement companies - Vegrow, NDDB, etc.

It is the best college in every aspect.from infrastructure to placement everything.