The World University of Design Placement Report 2025 has not been released yet. Since 2021, 200+ top companies have partnered with the university, helping over 90% of eligible students get good jobs. The University offers the highest package was INR 13.5 LPA, and the average package stood at INR 5.3 LPA. During the Internship, the highest stipend has been INR 35,000 per month, and the average stipend has been INR 15,500 per month. The recruiters are Axiom India, Meraki, Squareboat, Think Design, CII, Amazon, AB InBev, Incedo, Satya Paul, Max, Reliance, Ogilvy, and Crimsoune Club, among others.
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World University of Design Placement Highlights 2025
The World University of Design Placement Report 2025 has not been released yet. Tabulated below are the overall important highlights:
Particulars | Statistics |
---|---|
Highest Package | INR 13.5 LPA |
Average Package | INR 5.3 LPA |
Top Recruiters | Axiom India, Meraki, Squareboat, Think Design, CII, Amazon, AB InBev, Incedo, Satya Paul, Max, Reliance, Ogilvy, and Crimsoune Club, among others. |
World University of Design Placement 2025 - Top Recruiters
Below is the list of top recruiters at World University of Design:
World University of Design Placement FAQs
Ques. What is the highest and average package offered at World University of Design?
Ans. World University of Design offers the highest package of INR 13.5 LPA, and the average package is offered at INR 5.3 LPA, while the lowest package offered at World University of Design is INR 3 LPA.
Ques. Does the World University of Design provide placement training?
Ans. As per our research, World University of Design offers a training & placement cell for soft skills development for its students. Also, World University of Design provides resume-building and mock interviews to help students prepare for job opportunities.
Ques. Is internship support provided at the World University of Design?
Ans. Yes, as per our research, at World University of Design, many students get help in securing internships through college-industry tie-ups, especially in software and technical domains.
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