Rajiv Academy for Technology and Management Mathura Placement Report 2025 has not been published yet. As per our research, the highest salary package offered was INR 35 LPA, while the average package was INR 7.35 LPA. The top recruiters for Rajiv Academy for Technology and Management Mathura Placements are IBM, NIIT, Amazon, Byjus, IBM, OYO, Hyundai, GGK Tech and Accenture.
Rajiv Academy for Technology and Management Mathura Placement Highlights 2025
Rajiv Academy for Technology and Management, Mathura Placement Report 2025 has not been released yet. However, tabulated below are the overall important highlights:
Details | Statistics |
---|---|
Highest Package | INR 35 LPA |
Average Package | INR 7.35 LPA |
Top Recruiters | IBM, NIIT, Amazon, Byjus, IBM, OYO, Hyundai, GGK Tech and Accenture |
Rajiv Academy for Technology and Management Mathura Placement 2025 - Top Recruiters
Below is the list of top recruiters at Rajiv Academy for Technology and Management:
Rajiv Academy for Technology and Management Mathura Placement 2025 FAQs
Ques. What is the highest and average package offered at Rajiv Academy for Technology and Management, Mathura?
Ans. According to our research, Rajiv Academy for Technology and Management, Mathura, offers the highest package is INR 35 LPA, and the average package is offered at INR 7.35 LPA.
Ques. Does Rajiv Academy for Technology and Management Mathura, provide placement training?
Ans. As per our research, Rajiv Academy for Technology and Management Mathura, offers a training & placement cell for soft skills development for its students. Also, Rajiv Academy for Technology and Management Mathura provides resume-building and mock interviews to help students prepare for job opportunities.
Ques. Is internship support provided at the Rajiv Academy for Technology and Management, Mathura?
Ans. Yes, as per our research, at Rajiv Academy for Technology and Management, Mathura, many students get help in securing internships through college-industry tie-ups, especially in software and technical domains.
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